1.suitable for unsoldering multiple cmponents such as SOIC,CHIP,QFP,PLCC and BGA etc(especially for flat cables and cable connectors). 2.applicable for hot contraction heating depainting degluing defrosting preheating and rubber soldering and so forth. 2.the air flow can be adjustable and air blowing is big and gentle blowing plastic components won't be deformed. such as buzzer and external interface of mobile phone 4.automatic to blow cool air to safe the heating. temperature rapidly rises, and it can reach to the setting temperature only within 3 or 5 seconds. small volume light weigh, temp-control accurately 5. safely remove BGA-IC ,keep pins intact Much more safe